Protective film peeling apparatus and method of peeling a protective film using the same

ABSTRACT

A protective film peeling apparatus includes a peeling tape, a tape support portion disposed under one side of the peeling tape, a first pressing portion which is disposed on the one side of the peeling and fixes the one side of the peeling tape to the tape support portion, a second pressing portion which is disposed on another side of the peeling tape and presses and attaches the another side of the peeling tape to one side of a dummy portion of a protective film on a panel, and a grip portion disposed on the dummy portion. The tape support portion and the first pressing portion peel the one side of the dummy portion and a predetermined portion of the dummy portion, and the grip portion peel a remaining portion of the dummy portion.

This application is a divisional of U.S. patent application Ser. No.16/035,978, filed on Jul. 16, 2018, which claims priority to KoreanPatent Application No. 10-2017-0133548, filed on Oct. 13, 2017, and allthe benefits accruing therefrom under 35 U.S.C. § 119, the content ofwhich in its entirety is herein incorporated by reference.

BACKGROUND 1. Field

Exemplary embodiments of the invention relate to a protective filmpeeling apparatus and a method of peeling a protective film using thesame. More particularly, exemplary embodiments of the invention relateto a protective film peeling apparatus capable of easily peeling aprotective film of a mother panel and a method of peeling a protectivefilm using the same.

2. Description of the Related Art

Display devices, e.g., a monitor, iPad, a smart phone, and a tabletpersonal computer (“PC”) providing images to users may generally includedisplay panels displaying images. The display panels may include varioustypes of panels such as a liquid crystal display panel, an organic lightemitting display panel, an electrowetting display panel, and anelectrophoretic display panel.

Recently, display devices having flexible display panels and stretchabledisplay panels have been developed with a technology development of thedisplay devices. The flexible display panels may be foldable orrollable, and the stretchable display panels may be stretchable in atleast one direction. These display devices may be modified inpredetermined forms or may be modified in various forms by users. Thedisplay devices including the flexible display panels may furtherinclude a protective film which is disposed under the flexible displaypanels to protect a lower portion of the flexible display panels.

SUMMARY

Exemplary embodiments of the invention may provide a protective filmpeeling apparatus capable of easily peeling a protective film of amother panel and a method of peeling a protective film using the same.

In an exemplary embodiment of the invention, a protective film peelingapparatus may include a peeling tape extending in a first direction, atape support portion disposed under one side of the peeling tape, afirst pressing portion disposed on the one side of the peeling tape andmoving in a downward direction to press and fix the one side of thepeeling tape to the tape support portion, a second pressing portiondisposed on another side of the peeling tape and pressing the anotherside of the peeling tape to one side of a dummy portion of a protectivefilm on a panel to attach the another side of the peeling tape to theone side of the dummy portion, and a grip portion disposed on the dummyportion. The tape support portion and the first pressing portion maymove in an upward direction to peel the one side of the dummy portionand a predetermined portion of the dummy portion, and the grip portionmay grip the peeled predetermined portion of the dummy portion to peel aremaining portion of the dummy portion.

In an exemplary embodiment of the invention, a method of peeling aprotective film may include disposing one side of a peeling tapeextending in a first direction on a tape support portion, moving a firstpressing portion disposed on the one side of the peeling tape in adownward direction to press and fix the one side of the peeling tape tothe tape support portion, moving a second pressing portion disposed onanother side of the peeling tape in the downward direction to press andattach the another side of the peeling tape to one side of a dummyportion of a protective film of a mother panel, moving the secondpressing portion in an upward direction and moving the tape supportportion and the first pressing portion in the upward direction to peelthe one side of the dummy portion and a predetermined portion of thedummy portion, and peeling a remaining portion of the dummy portion bygripping the peeled predetermined portion of the dummy portion with agrip portion.

In an exemplary embodiment of the invention, a protective film peelingapparatus may include a peeling tape supply portion supplying a peelingtape extending in a first direction, a first guide portion and a secondguide portion disposed under the peeling tape supply portion, a firstguide roller and a second guide roller disposed under the first guideportion and the second guide portion, respectively, and supplied withthe peeling tape to move the peeling tape in the first direction, apressing portion disposed between the first and second guide portionsand moving in a downward direction to press and attach the peeling tapebetween the first and second guide rollers to one side of a dummyportion of a protective film on a panel, and a grip portion disposedadjacent to the first and second guide portions. The first and secondguide rollers and the pressing portion may move in an upward directionto peel the one side of the dummy portion and a predetermined portion ofthe dummy portion, and the grip portion may move in the downwarddirection to grip the peeled predetermined portion of the dummy portionand peels a remaining portion of the dummy portion.

In an exemplary embodiment of the invention, a method of peeling aprotective film may include providing a peeling tape extending in afirst direction to a first guide roller and a second guide roller whichrotate, stopping the rotation of the first and second guide rollers andmoving a pressing portion in a downward direction to press and attachthe peeling tape between the first and second guide rollers to one sideof a dummy portion of a protective film on a panel, moving the first andsecond guide rollers and the pressing portion in an upward direction topeel the one side of the dummy portion and a predetermined portion ofthe dummy portion, and moving a grip portion in the downward directionand gripping the peeled predetermined portion of the dummy portion withthe grip portion to peel a remaining portion of the dummy portion.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other exemplary embodiments and features of the inventionwill become more apparent by describing in further detail exemplaryembodiments thereof with reference to the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view illustrating an exemplaryembodiment of a protective film peeling apparatus according to theinvention;

FIGS. 2 and 3 are views illustrating one of head portions of FIG. 1;

FIG. 4 is a view illustrating one side surface of a second sub-gripportion of FIG. 3;

FIG. 5 is a view illustrating a peeling tape supply portion of FIG. 1;

FIG. 6 is a plan view illustrating peeling tapes of FIG. 5;

FIG. 7 is a plan view illustrating a mother panel of FIG. 1;

FIG. 8 is a cross-sectional view illustrating the mother panel of FIG.1;

FIG. 9 is a plan view for explaining widths of a first dummy portion, asecond dummy portion and the peeling tape;

FIG. 10 is a cross-sectional view illustrating a fixing portion of FIG.7;

FIGS. 11 and 12 are views illustrating a mother panel before the motherpanel is provided in a peeling apparatus through a stage;

FIGS. 13 to 20 are views illustrating a method of peeling a protectivefilm using the peeling apparatus of FIG. 1;

FIGS. 21 and 22 are side views illustrating a unit panel separated froma mother panel;

FIG. 23 is an equivalent circuit diagram of a pixel of a second portion;

FIG. 24 is a cross-sectional view illustrating the pixel of FIG. 23;

FIGS. 25 and 26 are views illustrating another exemplary embodiment of ahead portion of a protective film peeling apparatus according to theinvention; and

FIGS. 27 to 30 are views illustrating a method of peeling a protectivefilm using the head portion of FIGS. 25 and 26.

DETAILED DESCRIPTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various exemplaryembodiments are shown. This invention may, however, be embodied in manydifferent forms, and should not be construed as limited to the exemplaryembodiments set forth herein. Rather, these exemplary embodiments areprovided so that this invention will be thorough and complete, and willfully convey the scope of the invention to those skilled in the art.Like reference numerals refer to like elements throughout.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” another element, it can bedirectly on the other element or intervening elements may be present. Incontrast, the term “directly” means that there are no interveningelements. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. Theterminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the drawing figures. It will be understoodthat the spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the drawing figures. For example, if the devicein the drawing figures is turned over, elements described as “below” or“beneath” other elements or features would then be oriented “above” theother elements or features. Thus, the exemplary term “below” canencompass both an orientation of above and below. The device may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein interpreted accordingly.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer or section. Thus, a first element, component,region, layer or section discussed below could be termed a secondelement, component, region, layer or section without departing from theteachings herein. “About” or “approximately” as used herein is inclusiveof the stated value and means within an acceptable range of deviationfor the particular value as determined by one of ordinary skill in theart, considering the measurement in question and the error associatedwith measurement of the particular quantity (i.e., the limitations ofthe measurement system).

Exemplary embodiments are described herein with reference tocross-sectional illustrations and/or plane illustrations that areidealized exemplary illustrations. In the drawings, the thicknesses oflayers and regions are exaggerated for clarity. Accordingly, variationsfrom the shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, are to be expected. Thus,exemplary embodiments should not be construed as limited to the shapesof regions illustrated herein but are to include deviations in shapesthat result, for example, from manufacturing. For example, an etchingregion illustrated as a rectangle will, typically, have rounded orcurved features. Thus, the regions illustrated in the drawing figuresare schematic in nature and their shapes are not intended to illustratethe actual shape of a region of a device and are not intended to limitthe scope of exemplary embodiments.

Hereinafter, exemplary embodiments of the invention will be described indetail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view illustrating a protective filmpeeling apparatus according to an exemplary embodiment of the invention.

Referring to FIG. 1, a peeling apparatus 1000 according to an exemplaryembodiment of the invention may include a peeling portion 100 and apeeling tape supply portion 200. The peeling portion 100 may include amain stage MSTG, two rail portions RA, a stage STG, two first headsupport portions HS1, a second head support portion HS2, a plurality ofthird head support portions HS3, and a plurality of head portions HP.

The rail portions RA may be disposed on the main stage MSTG and mayextend in a first direction DR1. The two rail portions are illustratedas an example in FIG. 1. However, the invention is not limited thereto.In some exemplary embodiments, three or more rail portions RA may bedisposed on the main stage MSTG.

The stage STG may be disposed on the rail portions RA, and a motherpanel M_P may be disposed on the stage STG. The mother panel M_P may beplaced on the stage STG, and the stage STG may move along the railportions RA in the first direction DR1. The first direction DR1 may beopposite directions and may include a left direction and a rightdirection. In an exemplary embodiment, the stage STG may move in theright direction of the first direction DR1, for example.

The first head support portions HS1 may be arranged in a seconddirection DR2 intersecting the first direction DR1 and may berespectively disposed on both edge portions of the main stage MSTG withthe rail portions RA interposed therebetween. The first head supportportions HS1 may extend in a third direction DR3 intersecting a planeparallel to the first and second directions DR1 and DR2. Each of thesecond and third directions DR2 and DR3 may be opposite directions. Thethird direction DR3 may include an upward direction and a downwarddirection.

The second head support portion HS2 may be connected to top ends of thefirst head support portions HS1 and may extend in the second directionDR2. A length of the second head support portion HS2 in the seconddirection DR2 may be greater than a length of the main stage MSTG in thesecond direction DR2. Thus, one side of the second head support portionHS2 may be disposed outside the main stage MSTG.

The third head support portions HS3 extending in the third direction DR3may be provided on the second head support portion HS2, and the headportions HP may be provided on lower portions of the third head supportportions HS3. Three third head support portions HS3 and three headportions HP are illustrated as an example in FIG. 1. However, thenumbers of the third head support portions HS3 and the head portions HPare not limited thereto. In other exemplary embodiments, one headportion HP and one third head support portion HS3 may be provided in thepeeling portion 100, or two or four or more head portions HP and two orfour or more third head support portions HS3 may be provided in thepeeling portion 100.

The third head support portions HS3 may reciprocate along the secondhead support portion HS2 in the second direction DR2. The head portionsHP connected to the third head support portions HS3 may also reciprocatein the second direction DR2.

The third head support portions HS3 may move in the second direction DR2beyond the main stage MSTG to move the head portions HP closer to thepeeling tape supply portion 200. The head portions HP may be suppliedwith peeling tapes from the peeling tape supply portion 200. The peelingtape supply portion 200 and the peeling tapes will be described later inmore detail.

After the head portions HP are supplied with the peeling tapes, thethird head support portions HS3 may move in the second direction DR2 tomove the head portions HP onto the main stage MSTG. The head portions HPmay peel dummy portions of a protective film of the mother panel M_P bythe peeling tapes. The feature and operation will be described later inmore detail. Even though not shown in the drawings, an image sensingportion for checking a position of the mother panel M_P disposed on thestage STG may be provided at each of the head portions HP.

FIGS. 2 and 3 are views illustrating one of head portions of FIG. 1.FIG. 2 is a view of the head portion HP when viewed in the seconddirection DR2, and FIG. 3 is a view of the head portion HP when viewedin the first direction DR1. One head portion HP is illustrated as anexample in FIGS. 2 and 3. However, other head portions HP may have thesame structure or components as illustrated in FIGS. 2 and 3.

Referring to FIGS. 2 and 3, the head portion HP may include first andsecond main support portions MSP1 and MSP2, first and second sub-supportportions SSP1 and SSP2, a tape support portion TSP, a grip supportportion GSP, first and second main driving portions MDV1 and MDV2,first, second and third driving portions DV1, DV2 and DV3, a suctionportion ST, and a grip portion GP.

The first main support portion MSP1 may extend in the third directionDR3, and the first main driving portion MDV1 may be connected to anupper portion of the first main support portion MSP1. The first maindriving portion MDV1 may move the first main support portion MSP1 inupward and downward directions. The upward and downward directions maybe the upward and downward directions of the third direction DR3.

The second main support portion MSP2 may extend in the first directionDR1 and may be connected to a predetermined portion of the first mainsupport portion MSP1. The second main driving portion MDV2 may beconnected to a bottom of one side (e.g., right side in FIG. 2) of thesecond main support portion MSP2 adjacent to the first main supportportion MSP1, and a moving portion MP may be connected to a left side ofthe second main driving portion MDV2. The second main driving portionMDV2 may reciprocate the moving portion MP in the first direction DR1.

The first sub-support portion SSP1 may be connected to a bottom of themoving portion MP and may extend in the first direction DR1. The secondsub-support portion SSP2 extending in the third direction DR3 may beconnected to a bottom of one side of the first sub-support portion SSP1(e.g., right side in FIG. 2), closer to the first main support portionMSP1 than another side (e.g., left side in FIG. 2), of the firstsub-support portion SSP1 is to the first main support portion MSP1.

The first driving portion DV1, the suction portion ST and the seconddriving portion DV2 may be connected to a bottom of the firstsub-support portion SSP1. The first driving portion DV1 may be disposedadjacent to the second sub-support portion SSP2. The second drivingportion DV2 may be disposed at a left side of the first driving portionDV1 so as to be connected to a bottom of another side of the firstsub-support portion SSP1 opposite to the one side of the firstsub-support portion SSP1. The suction portion ST may be disposed betweenthe first driving portion DV1 and the second driving portion DV2.

The tape support portion TSP may be connected to a bottom of the secondsub-support portion SSP2 and may extend in the first direction DR1. Afirst pressing portion PS1 may be connected to a bottom of the firstdriving portion DV1, and the first driving portion DV1 may verticallymove the first pressing portion PS1. A second pressing portion PS2 maybe connected to a bottom of the second driving portion DV2, and thesecond driving portion DV2 may vertically move the second pressingportion PS2.

The tape support portion TSP may be spaced apart from the first pressingportion PS1 and may be disposed under the first pressing portion PS1.The second driving portion DV2 and the second pressing portion PS2 maybe disposed at a left side of the first driving portion DV1 and thefirst pressing portion PS1 when viewed in the second direction DR2.

The third driving portion DV3 may be connected to a bottom of anotherside (e.g., left side in FIG. 2) of the second main support portion MSP2opposite to the one side of the second main support portion MSP2. Thegrip support portion GSP may be connected to a bottom of the thirddriving portion DV3, and the grip portion GP may be connected to abottom of the grip support portion GSP. The third driving portion DV3may vertically move the grip support portion GSP to vertically move thegrip portion GP. The grip support portion GSP and the grip portion GPmay be spaced apart from the second pressing portion PS2. The gripportion GP may have an L-shape when viewed in the second direction DR2.

The grip portion GP may include a first grip portion GP1 and a secondgrip portion GP2 spaced apart from each other. The second pressingportion PS2 may move in the downward direction and the upward directionthrough a space between the first grip portion GP1 and the second gripportion GP2. Each of the first and second grip portions GP1 and GP2 mayhave an L-shape when viewed in the second direction DR2. A top end ofthe first grip portion GP1 and a top end of the second grip portion GP2may be connected in the grip support portion GSP and may be disposedadjacent to each other.

A first rotating unit RP1 may be connected to the top end of the firstgrip portion GP1, and a second rotating unit RP2 may be connected to thetop end of the second grip portion GP2. The first rotating unit RP1 andthe second rotating unit RP2 may rotate the top end of the first gripportion GP1 and the top end of the second grip portion GP2,respectively. Since the top ends of the first and second grip portionsGP1 and GP2 are rotated by the first and second rotating units RP1 andRP2, respectively, the first grip portion GP1 and the second gripportion GP2 may move closer to each other.

The first grip portion GP1 may include a first sub-grip portion GP1_1connected to the first rotating unit RP1 of the grip support portionGSP, and a second sub-grip portion GP1_2 connected to a bottom of thefirst sub-grip portion GP1_1 and having an L-shape when viewed in thesecond direction DR2. The second grip portion GP2 may include a thirdsub-grip portion GP2_1 connected to the second rotating unit RP2 of thegrip support portion GSP, and a fourth sub-grip portion GP2_2 connectedto a bottom of the third sub-grip portion GP2_1 and having an L-shapewhen viewed in the second direction DR2.

Since top ends of the first and third sub-grip portions GP1_1 and GP2_1are rotated by the first and second rotating units RP1 and RP2, thesecond and fourth sub-grip portions GP1_2 and GP2_2 connected to thefirst and third sub-grip portions GP1_1 and GP2_1 may move closer toeach other. Anti-adhesion coating layers CT may be respectively providedon one side surface (e.g., right side surface in FIG. 3) of the secondsub-grip portion GP1_2 and one side surface (e.g., left side surface inFIG. 3) of the fourth sub-grip portion GP2_2, which face each other. Inan exemplary embodiment, each of the anti-adhesion coating layers CT maybe a fluorine coating layer, for example.

Since the first main driving portion MDV1 may move the first mainsupport portion MSP1 in the upward and downward directions, the tapesupport portion TSP, the first and second pressing portions PS1 and PS2,the suction portion ST and the grip portion GP may be moved together inthe upward and downward directions by the first main driving portionMDV1. In addition, since the second main driving portion MDV2 mayreciprocate the first sub-support portion SSP1 in the first directionDR1, the first and second pressing portions PS1 and PS2 and the tapesupport portion TSP may be reciprocated together in the first directionDR1 by the second main driving portion MDV2.

FIG. 4 is a view illustrating one side surface of a second sub-gripportion of FIG. 3. Even though not shown in FIG. 4, the one side surfaceof the fourth sub-grip portion GP2_2 may have the same components as theone side surface of the second sub-grip portion GP1_2 illustrated inFIG. 4.

Referring to FIG. 4, a plurality of air jet holes AH may be disposed atthe one side surface of the second sub-grip portion GP1_2. Air may jetto the outside through the air jet holes AH. The one side surface of thesecond sub-grip portion GP1_2 may have an uneven structure. In anexemplary embodiment, the one side surface of the second sub-gripportion GP1_2 may include a plurality of protrusions PT, for example.Likewise, the air jet holes AH may also be disposed at the one sidesurface of the fourth sub-grip portion GP2_2, and the one side surfaceof the fourth sub-grip portion GP2_2 may also have the uneven structure.

FIG. 5 is a view illustrating a peeling tape supply portion of FIG. 1.FIG. 6 is a plan view illustrating peeling tapes of FIG. 5.

Referring to FIGS. 5 and 6, the peeling tape supply portion 200 mayinclude first and second big rollers BRO1 and BRO2, first to fifth smallrollers SRO1 to SRO5, a rolling film RF, and a plurality of peelingtapes PTP.

The peeling tapes PTP may be attached or adhere on the rolling film RF,and the rolling film RF may be wound on the first big roller BRO1. Therolling film RF may extend in the second direction DR2, and the peelingtapes PTP may extend in the first direction DR1. One side of each of thepeeling tapes PTP may be provided in the head portion HP, and anotherside of each of the peeling tapes PTP may be attached or adhere on therolling film RF. A peeling adhesive PAD may be disposed on the anotherside of each of the peeling tapes PTP. The peeling adhesive PAD may beattached to a bottom of the another side of each of the peeling tapesPTP.

Diameters of the first and second big rollers BRO1 and BRO2 may begreater than those of the first to fifth small rollers SRO1 to SRO5. Thefirst and second big rollers BRO1 and BRO2 and the first to fifth smallrollers SRO1 to SRO5 may move the rolling film RF while rotating. In anexemplary embodiment, the first and second big rollers BRO1 and BRO2 andthe third small roller SRO3 may rotate in a counterclockwise direction,and the first, second, fourth and fifth small rollers SRO1, SRO2, SRO4and SRO5 may rotate in a clockwise direction, for example.

The rolling film RF wound on the first big roller BRO1 may be providedto the first small roller SRO1 and then may be provided to the secondsmall roller SRO2 via the first small roller SRO1. The first and secondsmall rollers SRO1 and SRO2 may move the rolling film RF while rotating,and the rolling film RF may be moved in contact with outercircumferential surfaces of the first and second small rollers SRO1 andSRO2.

The peeling tapes PTP disposed between the first and second smallrollers SRO1 and SRO2 may be detached or separated from the rolling filmRF and may be provided to the head portions HP, respectively. When thepeeling tapes PTP are detached from the rolling film RF so as to beprovided to the head portions HP, the operation of rotating the firstand second small rollers SRO1 and SRO2 may be stopped. The number of thepeeling tapes PTP disposed between the first and second small rollersSRO1 and SRO2 may be equal to the number of the head portions HP, andthus the peeling tapes PTP between the first and second small rollersSRO1 and SRO2 may be provided to the head portions HP, respectively.

When the peeling tapes PTP are detached from the rolling film RF, aplurality of rolling film support members RFSP may be provided over andunder the rolling film RF disposed between the first and second smallrollers SRO1 and SRO2 to prevent the rolling film RF from shaking. Therolling film support members RFSP disposed over the rolling film RF mayoverlap with the rolling film support members RFSP disposed under therolling film RF.

When the peeling tapes PTP are detached from the rolling film RF, therolling film support members RFSP disposed over and under the rollingfilm RF may move toward the rolling film RF to contact the rolling filmRF, and thus the rolling film support members RFSP may support therolling film RF to prevent the rolling film RF from following thepeeling tapes PTP.

After the peeling tapes PTP are provided to the head portions HP, therolling film RF may be provided to and wound on the second big rollerBRO2 through the third, fourth and fifth small rollers SRO3, SRO4 andSRO5 which are rotated. The rolling film RF may be moved in contact withouter circumferential surfaces of the third, fourth and fifth smallrollers SRO3, SRO4 and SRO5.

FIG. 7 is a plan view illustrating a mother panel of FIG. 1. FIG. 8 is across-sectional view illustrating the mother panel of FIG. 1. FIG. 9 isa plan view for explaining widths of a first dummy portion, a seconddummy portion and the peeling tape. FIG. 10 is a cross-sectional viewillustrating a fixing portion of FIG. 7.

Referring to FIGS. 7, 8 and 9, the mother panel M_P may include aplurality of unit panels U_P arranged along rows and columns in a planview defined by the first and second directions DR1 and DR2. The rowsmay be parallel to the second direction DR2, and the columns may beparallel to the first direction DR1. Each of the unit panels U_P mayhave a rectangular shape that has short sides parallel to the firstdirection DR1 and long sides parallel to the second direction DR2.

Each of the unit panels U_P may include a driving chip IC and aplurality of pixels (not shown) driven by the driving chip IC. Thedriving chip IC may be disposed adjacent to one of the short sides ofthe unit panel U_P. Each of the unit panels U_P may include a bendingportion BA extending in the first direction DR1, and the driving chip ICmay be disposed between the bending portion BA and the one short side ofthe unit panel U_P.

The mother panel M_P may include a panel PN, a first protective filmPF1, a second protective film PF2, a first adhesive member AD1, and asecond adhesive member AD2. The first protective film PF1 may bedisposed on one surface (e.g., upper surface in FIG. 8) of the panel PN,and the second protective film PF2 may be disposed on another surface(e.g., lower surface in FIG. 8) of the panel PN opposite to the onesurface of the panel PN. When the mother panel M_P is placed on thestage STG, the second protective film PF2 may face the stage STG (referto FIG. 1) and the first protective film PF1 may be disposed over thesecond protective film PF2.

The first adhesive member AD1 may be disposed between the panel PN andthe first protective film PF1 to attach the first protective film PF1 tothe one surface (e.g., upper surface in FIG. 8) of the panel PN. Thesecond adhesive member AD2 may be disposed between the panel PN and thesecond protective film PF2 to attach the second protective film PF2 tothe another surface (e.g., lower surface in FIG. 8) of the panel PN.

Even though not shown in FIG. 8, the driving chips IC and the pixels maybe disposed in the panel PN, and the panel PN may also include the unitpanels U_P in a plan view.

The first protective film PF1 may include a plurality of dummy portionsDUM which may extend in the first direction DR1 and may be arranged inthe second direction DR2. Each of the dummy portions DUM may extendthrough the bending portions BA of the unit panels U_P arranged in thefirst direction DR1. The dummy portions DUM may overlap with the bendingportions BA in the unit panels U_P.

Each of the dummy portions DUM may include a first dummy portion DUM1disposed on a predetermined portion of one side of the first protectivefilm PF1, and a second dummy portion DUM2 extending from the first dummyportion DUM1 in the first direction DR1. The first dummy portion DUM1may define one side (e.g., upper side in FIG. 9) of each of the dummyportions DUM, and the second dummy portion DUM2 may extend to overlapwith the bending portions BA of the unit panels U_P arranged in thefirst direction DR1.

A width of the first dummy portion DUM1 in the second direction DR2 maybe greater than a width of the second dummy portion DUM2 in the seconddirection DR2. In addition, a width of the peeling tape PTP in thesecond direction DR2 may be less than the width of the first dummyportion DUM1 and may be greater than the width of the second dummyportion DUM2. However, the invention is not limited thereto. In someexemplary embodiments, the width of the peeling tape PTP may be equal tothe width of the first dummy portion DUM1. The another side (e.g., lowerside in FIG. 9) of the peeling tape PTP may adhere on the first dummyportion DUM1 by the peeling adhesive PAD.

The unit panels U_P arranged along three columns are illustrated as anexample in FIG. 7. However, the invention is not limited thereto. Insome exemplary embodiments, the unit panels U_P arranged along one, two,four or more columns may be provided in the mother panel M_P. In analternative exemplary embodiment, one unit panel U_P may be provided inthe mother panel M_P.

The head portions HP (refer to FIG. 1) may be disposed to correspond tothe columns of the unit panels U_P, and the head portions HP may peelthe dummy portions DUM from the mother panel M_P, respectively. However,the invention is not limited thereto. In some exemplary embodiments, onehead portion HP may be provided to peel the dummy portions DUM one byone.

Referring to FIGS. 7 and 10, a plurality of fixing portions FP may bedisposed at one side (e.g., right side in FIG. 10) of the stage STGadjacent to the first dummy portions DUM1, each of which defines the oneside of each of the dummy portions DUM. The fixing portions FP may beconnected to a plurality of fourth driving portions DV4 which may berespectively disposed under the fixing portions FP and which may beconnected to the one side of the stage STG.

The fourth driving portions DV4 may move the fixing portions FP in theupward and downward directions. The fixing portions FP may be moved inthe downward direction to press the mother panel M_P adjacent to thefirst dummy portions DUM1, and thus the mother panel M_P may be fixed bythe fixing portions FP. Substantially, the fixing portions FP may pressthe first protective film PF1 to fix the mother panel M_P. When thefirst dummy portions DUM1 are peeled, the fixing portions FP may preventa lifting phenomenon of the one side of the mother panel M_P adjacent tothe first dummy portions DUM1.

FIGS. 11 and 12 are views illustrating a mother panel before the motherpanel is provided in a peeling apparatus through a stage. One unit panelU_P is illustrated in FIGS. 11 and 12 for the purpose of ease andconvenience in description and illustration.

Referring to FIGS. 11 and 12, ultraviolet laser UV may be irradiated tothe dummy portion DUM of the mother panel M_P, and CO₂ laser CO2 may beirradiated to a boundary of the dummy portion DUM. When the ultravioletlaser UV and the CO₂ laser CO2 are irradiated, the mother panel M_P maybe turned over, unlike FIG. 8. In other words, the first protective filmPF1 may be disposed under the second protective film PF2, and theultraviolet laser UV and the CO₂ laser CO2 may be irradiated to thedummy portion DUM of the first protective film PF1 under the motherpanel M_P.

The boundary of the dummy portion DUM may be cut by the CO₂ laser CO2,and adhesive strength of the first adhesive member AD1 on the dummyportion DUM may be reduced by the ultraviolet laser UV. The panel PN mayinclude a base substrate including polyimide and the pixels disposed onthe base substrate. When the ultraviolet laser UV is irradiated to thebase substrate, hydrogen may be generated from the base substrate toreduce the adhesive strength between the base substrate and the firstadhesive member AD1.

When the ultraviolet laser UV is irradiated for a time equal to orgreater than a reference time, the first adhesive member AD1 may becarbonized. The ultraviolet laser UV may be irradiated to the firstdummy portion DUM1 for a time equal to or greater than the referencetime and may be irradiated to the second dummy portion DUM2 for a timeless than the reference time. Thus, the first adhesive member AD1 on thefirst dummy portion DUM1 may be carbonized.

The mother panel M_P treated by the ultraviolet laser UV and the CO₂laser CO2 may be placed on the stage STG (refer to FIG. 10). When themother panel M_P is placed on the stage STG, the second protective filmPF2 may be disposed under the first protective film PF1 and may beplaced on the stage STG, and the first protective film PF1 may face thehead portion HP.

FIGS. 13 to 20 are views illustrating a method of peeling a protectivefilm using the peeling apparatus of FIG. 1. Peeling operations of thehead portions HP may be the same as each other, and thus the peelingoperation of one head portion HP will be described hereinafter as anexample with reference to FIGS. 13 to 20. The stage STG is omitted inFIGS. 13 to 20 for the purpose of ease and convenience in descriptionand illustration.

Referring to FIG. 13, the head portion HP may move to be adjacent to thepeeling tape supply portion 200 (refer to FIG. 1), and the peeling tapePTP may be provided to the head portion HP through the rolling film RF.The one side (e.g., right side of FIG. 13) of the peeling tape PTP maybe disposed on the tape support portion TSP, and the tape supportportion TSP may be disposed under the one side of the peeling tape PTPto support the one side of the peeling tape PTP.

The first pressing portion PS1 may move in the downward direction by thefirst driving portion DV1 to press the one side of the peeling tape PTPto the tape support portion TSP. Since the first pressing portion PS1presses the one side of the peeling tape PTP, the one side of thepeeling tape PTP may be fixed between the first pressing portion PS1 andthe tape support portion TSP. The one side of the peeling tape PTP maybe fixed on the tape support portion TSP, and the peeling tape PTP maybe detached from the rolling film RF. The head portion HP supplied withthe peeling tape PTP may move onto the stage STG (refer to FIG. 1) onwhich the mother panel M_P is disposed.

The grip portion GP may be disposed over the dummy portion DUM (refer toFIG. 16) and may move in the upward direction by the third drivingportion DV3 so as to be disposed above the tape support portion TSP. Thesecond pressing portion PS2 may be disposed between the first gripportion GP1 (refer to FIG. 3) and the second grip portion GP2 (refer toFIG. 3).

Referring to FIG. 14, the mother panel M_P may move under the headportion HP by the stage STG (refer to FIG. 1). The another side (e.g.,left side in FIG. 14) of the peeling tape PTP may be disposed over thefirst dummy portion DUM1 (refer to FIG. 16) of the first protective filmPF1 to overlap with the first dummy portion DUM1. The second pressingportion PS2 (refer to FIG. 15) may be disposed over the another side ofthe peeling tape PTP to overlap with the another side of the peelingtape PTP.

Referring to FIG. 15, the second pressing portion PS2 may move in thedownward direction between the first and second grip portions GP1 (referto FIG. 3) and GP2 (refer to FIG. 3) by the second driving portion DV2.The second pressing portion PS2 may move in the downward direction topress the another side (e.g., left side in FIG. 15) of the peeling tapePTP to the first dummy portion DUM1 (refer to FIG. 16). The another sideof the peeling tape PTP may be attached to the first dummy portion DUM1by the peeling adhesive PAD provided on the another side of the peelingtape PTP.

Referring to FIG. 16, the second pressing portion PS2 (refer to FIG. 15)may move in the upward direction by the second driving portion DV2 afterattaching the another side of the peeling tape PTP to the first dummyportion DUM1. Thereafter, the first main driving portion MDV1 may movethe first main support portion MSP1 in the upward direction, and thusthe tape support portion TSP, the first and second pressing portions PS1and PS2, the suction portion ST and the grip portion GP may movetogether in the upward direction.

Since the first pressing portion PS1 fixes the one side of the peelingtape PTP on the tape support portion TSP, the one side of the dummyportion DUM attached to the another side of the peeling tape PTP may bepeeled and then another portion of the dummy portion DUM may be peeledwhile the peeling tape PTP moves in the upward direction. In anexemplary embodiment, the first dummy portion DUM1 may be peeled fromthe mother panel M_P, and then, a predetermined portion of the seconddummy portion DUM2 may also be peeled from the mother panel M_P as thefirst pressing portion PS1 and the tape support portion TSP move in theupward direction, for example.

When the first dummy portion DUM1 is peeled, the lifting phenomenon ofthe mother panel M_P may be prevented since the fixing portion FP ofFIGS. 7 and 10 fixes the mother panel M_P. The peeling adhesive PAD mayhave an adhesive strength stronger than that of the first adhesivemember AD1 (refer to FIG. 12). Thus, the first dummy portion DUM1 may beeasily peeled by the peeling adhesive PAD.

Since the first adhesive member AD1 overlapping with the first dummyportion DUM1 is carbonized, an initial process of peeling the firstdummy portion DUM1 may be easily performed. When carbonized particles ofthe first adhesive member AD1 overlapping with the first dummy portionDUM1 are dispersed, the carbonized particles may be adsorbed on themother panel M_P to contaminate the mother panel M_P. When the firstdummy portion DUM1 is peeled, the suction portion ST may operate to suckand remove the carbonized particles of the first adhesive member AD1.

Referring to FIG. 17, after a predetermined portion of the dummy portionDUM is peeled, the grip portion GP may move in the downward direction bythe third driving portion DV3 so as to be disposed below the tapesupport portion TSP. The first grip portion GP1 (refer to FIG. 3) andthe second grip portion GP2 (refer to FIG. 3) may move to be adjacent toeach other and may grip the peeled predetermined portion of the seconddummy portion DUM2. In more detail, the second sub-grip portion GP1_2(refer to FIG. 3) and the fourth sub-grip portion GP2_2 (refer to FIG.3) may move to be adjacent to each other and may grip the peeledpredetermined portion of the second dummy portion DUM2.

Referring to FIG. 18, when the grip portion GP grips the peeledpredetermined portion of the second dummy portion DUM2, the firstpressing portion PS1 may move in the upward direction by the firstdriving portion DV1 so as to be spaced apart from the tape supportportion TSP. Thus, the peeling tape PTP may be separated from the tapesupport portion TSP.

The second main driving portion MDV2 may move the moving portion MP inthe right direction to move the first sub-support portion SSP1 connectedto the moving portion MP in the right direction. Thus, the first andsecond pressing portions PS1 and PS2, the suction portion ST and thetape support portion TSP may move away from the grip portion GP by thesecond main driving portion MDV2.

Referring to FIG. 19, after the grip portion GP grips the peeledpredetermined portion of the second dummy portion DUM2, the stage STGrefer to FIG. 1) may move in the right direction of the first directionDR1 to move away from the grip portion GP. Thus, a remaining portion ofthe dummy portion DUM may be peeled from the mother panel M_P by thegrip portion GP while the mother panel M_P moves.

Referring to FIG. 20, the first and second grip portions GP1 and GP2 maymove to be spaced apart from each other, and thus the peeling tape PTPand the dummy portion DUM peeled from the mother panel M_P (refer toFIG. 19) may be discarded into a dummy box D_B.

The first adhesive member AD1 may remain on the peeled dummy portionDUM. Since the anti-adhesion coating layers CT are provided on the oneside surface of the second sub-grip portion GP1_2 and the one sidesurface of the fourth sub-grip portion GP2_2, the peeled dummy portionDUM may not be attached to the first and second grip portions GP1 andGP2 even though the first adhesive member AD1 remains on the peeleddummy portion DUM.

Since the one side surface of each of the second and fourth sub-gripportions GP1_2 and GP2_2 has the uneven structure, the peeled dummyportion DUM may not be attached to the first and second grip portionsGP1 and GP2. In addition, since the air is jetted through the air jetholes AH of the one side surface of each of the second and fourthsub-grip portions GP1_2 and GP2_2, the peeled dummy portion DUM may beeasily detached from the first and second grip portions GP1 and GP2.

After bringing a roller or a pin into contact with the one side of thedummy portion, the dummy portion DUM may be peeled by pushing the dummyportion DUM using the roller or the pin. In this case, the mother panelM_P may be moved on the stage by force of pushing the dummy portion DUMthrough the roller or the pin, or the panel PN may be lifted from thesecond protective film PF2 by the pushing force.

However, according to the exemplary embodiments of the invention, thedummy portion DUM may not be pushed, but the head portion HP may attachthe peeling tape PTP to the dummy portion DUM and may peel the dummyportion DUM by the peeling tape PTP. Thus, the mother panel M_P may notbe pushed from the stage STG, and the panel PN may not be lifted fromthe second protective film PF2. As a result, the dummy portion DUM maybe easily and stably peeled from the mother panel M_P.

FIGS. 21 and 22 are side views illustrating a unit panel separated froma mother panel.

Referring to FIGS. 21 and 22, the dummy portions DUM may be peeled fromthe mother panel M_P, and the mother panel M_P may be divided into theunit panels U_P. The unit panel U_P may be defined as a display panelDP. The first protective film PF1 may define a bottom surface of thedisplay panel DP, and the second protective film PF2 may define a topsurface of the display panel DP.

The display panel DP may include the bending portion BA and may furtherinclude a first portion PT1 and a second portion PT2 disposed with thebending portion BA interposed therebetween. The driving chip IC may bedisposed in the first portion PT1, and the second portion PT2 mayinclude a plurality of the pixels.

Since the dummy portion DUM of the bending portion BA is peeled, athickness of the bending portion BA may be smaller than those of thefirst and second portions PT1 and PT2. Since the bending portion BA hasthe small thickness, the bending portion BA of the display panel DP maybe easily bent. The bending portion BA may be bent, and the firstportion PT1 may be disposed under the second portion PT2.

FIG. 23 is an equivalent circuit diagram of a pixel of a second portion.FIG. 24 is a cross-sectional view illustrating the pixel of FIG. 23. Onepixel PX is illustrated in FIG. 23. However, other pixels PX may havethe same structure or configuration as the pixel PX illustrated in FIG.23.

Referring to FIG. 23, the pixel PX may be connected to a scan line SLi,a data line DLj, and an emission line ELi. Here, ‘i’ and ‘j’ are naturalnumbers. The pixel PX may include a light emitting element OLED, adriving transistor T1, a capacitive element Cst, a switching transistorT2, and an emission control transistor T3. The light emitting elementOLED may be an organic light emitting diode.

A source terminal of the driving transistor T1 may be provided with afirst voltage ELVDD, and a drain terminal of the driving transistor T1may be connected to a source terminal of the emission control transistorT3. A gate terminal of the driving transistor T1 may be connected to adrain terminal of the switching transistor T2.

A gate terminal of the switching transistor T2 may be connected to thescan line SLi, and a source terminal of the switching transistor T2 maybe connected to the data line DLj. A first electrode of the capacitiveelement Cst may be connected to the source terminal of the drivingtransistor T1, and a second electrode of the capacitive element Cst maybe connected to the gate terminal of the driving transistor T1.

A gate terminal of the emission control transistor T3 may be connectedto the emission line ELi, and a drain terminal of the emission controltransistor T3 may be connected to an anode electrode of the lightemitting element OLED. A cathode electrode of the light emitting elementOLED may receive a second voltage ELVSS. A level of the second voltageELVSS may be lower than a level of the first voltage ELVDD.

The switching transistor T2 may be turned-on in response to a scansignal SCAN provided through the scan line SLi. The turned-on switchingtransistor T2 may provide a data voltage DATA received through the dataline DLj to the gate terminal of the driving transistor T1. Thecapacitive element Cst may store the data voltage DATA applied to thegate terminal of the driving transistor T1 and may retain the storeddata voltage DATA after the switching transistor T2 is turned-off.

The gate terminal of the emission control transistor T3 may receive anemission signal EM through the emission line ELi, and thus the emissioncontrol transistor T3 may be turned-on. The turned-on emission controltransistor T3 may provide a current Ioled flowing through the drivingtransistor T1 to the light emitting element OLED. The pixel PX may emitlight while the emission signal EM is applied to the emission controltransistor T3. An intensity of the light emitted from the light emittingelement OLED may be changed depending on the amount of the currentIoled.

In FIG. 23, the transistors T1 to T3 of the pixel PX may be P-typemetal-oxide-semiconductor (“PMOS”) transistors, for example. However,the invention is not limited thereto. In another exemplary embodiment,the transistors T1 to T3 of the pixel PX may be N-typemetal-oxide-semiconductor (“NMOS”) transistors, for example. Thetransistors T1 to T3 of the pixel PX may be defined as driving elements.

Referring to FIG. 24, a pixel PX may include a light emitting elementOLED and a transistor TR connected to the light emitting element OLED.The transistor TR may be the emission control transistor T3 of FIG. 23.The transistor TR and the light emitting element OLED may be disposed ona base substrate BSUB.

The first protective film PF1 may be disposed under the base substrateBSUB, and the first adhesive member AD1 may attach the first protectivefilm PF1 to the base substrate BSUB. The second protective film PF2(refer to FIGS. 21 and 22) is omitted in FIG. 24 for the purpose of easeand convenience in description and illustration.

The base substrate BSUB and the first protective film PF1 may haveflexibility and may be transparent. In an exemplary embodiment, the basesubstrate BSUB may include polyimide (“PI”), and the first protectivefilm PF1 may include polyethylene terephthalate (“PET”), for example.

A buffer layer BFL may be disposed on the base substrate BSUB. Thebuffer layer BFL may be an inorganic insulating layer including aninorganic material. A semiconductor layer SM of the transistor TR may bedisposed on the buffer layer BFL. In an exemplary embodiment, thesemiconductor layer SM may include an inorganic semiconductor such asamorphous silicon or poly-silicon or may include an organicsemiconductor, for example. In an alternative exemplary embodiment, thesemiconductor layer SM may include an oxide semiconductor, for example.Even though not shown in FIG. 24, the semiconductor layer SM may includea source region, a drain region, and a channel region between the sourceregion and the drain region.

A first insulating layer INS1 may be disposed on the buffer layer BFL tocover the semiconductor layer SM. A gate electrode GE of the transistorTR may be disposed on the first insulating layer INS1 and may overlapwith the semiconductor layer SM. The gate electrode GE may be disposedto overlap with the channel region of the semiconductor layer SM. Asecond insulating layer INS2 may be disposed on the first insulatinglayer INS1 to cover the gate electrode GE. The second insulating layerINS2 may be defined as an inter-insulating layer. The first and secondinsulating layers INS1 and INS2 may be inorganic insulating layersincluding an inorganic material.

A source electrode SE and a drain electrode DE of the transistor TR maybe spaced apart from each other on the second insulating layer INS2. Thesource electrode SE may be connected to the source region of thesemiconductor layer SM through a first contact hole H1 penetrating thefirst and second insulating layers INS1 and INS2. The drain electrode DEmay be connected to the drain region of the semiconductor layer SMthrough a second contact hole H2 penetrating the first and secondinsulating layers INS1 and INS2.

A third insulating layer INS3 may be disposed on the second insulatinglayer INS2 to cover the source electrode SE and the drain electrode DEof the transistor TR. The third insulating layer INS3 may be defined asa planarization layer providing a flat top surface. The third insulatinglayer INS3 may be an organic insulating layer including an organicmaterial.

A first electrode E1 of the light emitting element OLED may be disposedon the third insulating layer INS3. The first electrode E1 may beconnected to the drain electrode DE of the transistor TR through a thirdcontact hole H3 penetrating the third insulating layer INS3. The firstelectrode E1 may be defined as a pixel electrode or an anode electrode.The first electrode E1 may include a transparent electrode or areflective electrode.

A pixel defining layer PDL exposing a predetermined portion of the firstelectrode E1 may be disposed on the first electrode E1 and the thirdinsulating layer INS3. A pixel opening PX_OP exposing the predeterminedportion of the first electrode E1 may be defined in the pixel defininglayer PDL. An area in which the pixel opening PX_OP is disposed may bedefined as a pixel area PA. An area around the pixel area PA may bedefined as a non-pixel area.

An organic light emitting layer OEL may be disposed on the firstelectrode E1 in the pixel opening PX_OP. The organic light emittinglayer OEL may include an organic material capable of generating lighthaving one of a red color, a green color and a blue color, for example.In other words, the organic light emitting layer OEL may generate one ofred light, green light and blue light. However, the invention is notlimited thereto. In other exemplary embodiments, the organic lightemitting layer OEL may generate white light by a combination of organicmaterials generating red light, green light and blue light, for example.

The organic light emitting layer OEL may include a low-molecular organicmaterial or a high-molecular organic material. Even though not shown inthe drawings, in an exemplary embodiment, the organic light emittinglayer OEL may include a multi-layer that includes a hole injection layer(“HIL”), a hole transporting layer (“HTL”), a light emitting layer, anelectron transporting layer (“ETL”), and an electron injection layer(“EIL”), for example. The HIL may be disposed on the first electrode E1.The HTL, the light emitting layer, the ETL and the EIL may besequentially stacked on the HIL.

A second electrode E2 of the light emitting element OLED may be disposedon the pixel defining layer PDL and the organic light emitting layerOEL. The second electrode E2 may be defined as a common electrode or acathode electrode. The second electrode E2 may include a transparentelectrode or a reflective electrode. In an exemplary embodiment, whenthe display panel DP (refer to FIGS. 21 and 22) is a front emission typeorganic light emitting display panel, for example, the first electrodeE1 may be the reflective electrode and the second electrode E2 may bethe transparent electrode. In an exemplary embodiment, when the displaypanel DP is a back emission type organic light emitting display panel,for example, the first electrode E1 may be the transparent electrode andthe second electrode E2 may be the reflective electrode.

The light emitting element OLED may be provided in the pixel area PA andmay include the first electrode E1, the organic light emitting layerOEL, and the second electrode E2 in the pixel area PA. The firstelectrode E1 may be an anode corresponding to a hole injectionelectrode, and the second electrode E2 may be a cathode corresponding toan electron injection electrode. A first power source voltage may beapplied to the first electrode E1 and a second power source voltage, apolarity of which is opposite to that of the first power source voltage,may be applied to the second electrode E2. Thus, light may be emittedfrom the organic light emitting layer OEL of the light emitting elementOLED by the transistor TR. A protecting layer TFE may be disposed on thesecond electrode E2.

Holes and electrons injected in the organic light emitting layer OEL maybe combined with each other to generate excitons, and the excitons maytransition from an excited state to a ground state to emit light fromthe light emitting element OLED. The light emitting element OLED mayemit one of the red light, the green light and the blue light by a flowof a current to display a piece of image information.

FIGS. 25 and 26 are views illustrating a head portion of a protectivefilm peeling apparatus according to another exemplary embodiment of theinvention. FIG. 25 is a view of a head portion HP′ when viewed in thesecond direction DR2, and FIG. 26 is a view of the head portion HP′ whenviewed in the first direction DR1.

Hereinafter, differences between the head portion HP′ of FIGS. 25 and 26and the head portion HP of FIGS. 2 and 3 will be mainly described, andthe same components as in the exemplary embodiment of FIGS. 2 and 3 willbe indicated by the same reference designators.

Referring to FIGS. 25 and 26, the head portion HP′ may include first,second, third and fourth support portions SP1, SP2, SP3 and SP4, first,second and third driving portions DV1′, DV2′ and DV3′, a grip portionGP, a grip support portion GSP, a pressing portion PS, a peeling tapesupply portion 200′, first and second guide portions GD1 and GD2, andfirst and second guide rollers GRO1 and GRO2.

The first support portion SP1 may have a rectangular shape that has longsides parallel to the third direction DR3 and short sides parallel tothe first direction DR1. The peeling tape supply portion 200′ may beconnected to a front surface FS of the first support portion SP1, whichis parallel to the first and third directions DR1 and DR3. In thepeeling apparatus 1000 illustrated in FIG. 1, the head portion HP isseparated from the peeling tape supply portion 200. However, in apeeling apparatus according to the illustrated exemplary embodiment, thepeeling tape supply portion 200′ is connected to the head portion HP′.

The first and second guide portions GD1 and GD2 may be disposed underthe peeling tape supply portion 200′ and may be connected to the frontsurface FS of the first support portion SP1. The first and second guideportions GD1 and GD2 may extend in the third direction DR3 and may bespaced apart from each other in the first direction DR1. Bottom ends ofthe first and second guide portions GD1 and GD2 may be lower than abottom end of the first support portion SP1. The first guide roller GRO1and the second guide roller GRO2 may be disposed at a bottom of thefirst guide portion GD1 and a bottom of the second guide portion GD2,respectively.

The peeling tape supply portion 200′ may provide a peeling tape PTP′ tothe first guide roller GRO1 and the second guide roller GRO2, and thefirst and second guide rollers GRO1 and GRO2 may move the peeling tapePTP′ in the first direction DR1 while rotating. The peeling tape PTP′may be moved in contact with outer circumferential surfaces of the firstand second guide rollers GRO1 and GRO2. The peeling tape PTP′ may bereturned to the peeling tape supply portion 200′ after passing throughthe second guide roller GRO2.

The peeling tape supply portion 200′ may include first and second bigrollers BRO1 and BRO2, first, second, third and fourth small rollersSRO1, SRO2, SRO3 and SRO4, and the peeling tape PTP′. The first bigroller BRO1 and the second big roller BRO2 may be spaced apart from eachother in the third direction DR3 and may be connected to the frontsurface FS of the first support portion SP1. The second big roller BRO2may be disposed under the first big roller BRO1. The peeling tape PTP′may extend in the first direction DR1 and may be wound on the first bigroller BRO1.

The first, second and third small rollers SRO1, SRO2 and SRO3 may bedisposed below the second big roller BRO2 and may be arranged in thefirst direction DR1. The fourth small roller SRO4 may be disposedadjacent to the first big roller BRO1. A peeling adhesive PAD may beprovided on one surface of the peeling tape PTP′.

The first and second big rollers BRO1 and BRO2 and the first to fourthsmall rollers SRO1 to SRO4 may move the peeling tape PTP′ whilerotating. In an exemplary embodiment, the peeling tape PTP′ wound on thesecond big roller BRO2 may be provided to the first and second guiderollers GRO1 and GRO2 via the rotating first small roller SRO1, forexample.

The rotation of the first and second guide rollers GRO1 and GRO2 may bestopped in a peeling operation of the head portion HP′, and the peelingoperation may be performed by the peeling tape PTP′ disposed between thefirst and second guide rollers GRO1 and GRO2. The peeling adhesive PADmay be provided on a bottom surface of the peeling tape PTP′ disposedbetween the first and second guide rollers GRO1 and GRO2.

After the peeling operation is completed, the first and second guiderollers GRO1 and GRO2 may be rotated to move the peeling tape PTP′, andthe peeling tape PTP′ may be provided to and wound on the first bigroller BRO1 via the second, third and fourth small rollers SRO2, SRO3and SRO4 which are rotated.

The second support portion SP2 may be connected to a predeterminedportion of a back surface BS of the first support portion SP1 oppositeto the front surface FS of the first support portion SP1. The secondsupport portion SP2 may extend in the second direction DR2. The thirdsupport portion SP3 may be disposed on and connected to an end portionof the second support portion SP2. The third support portion SP3 may beconnected to the first driving portion DV1′ disposed on the thirdsupport portion SP3. The first driving portion DV1′ may move the thirdsupport portion SP3 in the upward and downward directions along thethird direction DR3, and thus the second support portion SP2 connectedto the third support portion SP3 and the first support portion SP1connected to the second support portion SP2 may be moved in the upwardand downward directions.

The fourth support portion SP4 may be disposed adjacent to the secondsupport portion SP2 and may extend in the third direction DR3. A railgroove RG extending in the third direction DR3 may be defined in thefourth support portion SP4. The second support portion SP2 may movealong the rail groove RG when moving in the upward and downwarddirections.

The second driving portion DV2′ may be disposed at a bottom portion ofthe first support portion SP1 and may be connected to the back surfaceBS of the first support portion SP1. The second driving portion DV2′ maybe disposed below the second support portion SP2. The pressing portionPS may be connected to a bottom of the second driving portion DV2′. Thepressing portion PS may be disposed between the first guide portion GD1and the second guide portion GD2. The pressing portion PS may move inthe downward direction to press and attach the peeling tape PTP′ to theone side of the dummy portion DUM of the first protective film PF1disposed on the panel PN.

The pressing portion PS may include a first pressing portion PS1′connected to the bottom of the second driving portion DV2′ and a secondpressing portion PS2′ connected to a bottom of the first pressingportion PS1′. The second pressing portion PS2′ may extend in the seconddirection DR2 so as to be disposed between a lower portion of the firstguide portion GD1 and a lower portion of the second guide portion GD2.The second pressing portion PS2′ may be disposed on the peeling tapePTP′ disposed between the first and second guide rollers GRO1 and GRO2.The second driving portion DV2′ may move the first pressing portion PS1′in the upward and downward directions, and thus the second pressingportion PS2′ connected to the first pressing portion PS1′ may be movedin the upward and downward directions.

The grip support portion GSP may be connected to a bottom of the thirddriving portion DV3′ and may be disposed adjacent to the first andsecond guide portions GD1 and GD2. The third driving portion DV3′ maymove the grip support portion GSP in the upward and downward directionsto move the grip portion GP in the upward and downward directions.Components of the grip portion GP and the grip support portion GSP maybe the same as those of the grip portion GP and the grip support portionGSP illustrated in FIG. 2, and thus the descriptions thereto areomitted.

Since the first driving portion DV1′ moves the third support portion SP3in the upward and downward directions, the first and second supportportions SP1 and SP2 may be moved in the upward and downward directions.Thus, the second and third driving portions DV2′ and DV3′, the first andsecond guide portions GD1 and GD2, the first and second guide rollersGRO1 and GRO2 and the pressing portion PS may be moved together in theupward and downward directions by the first driving portion DV1′.

At least one head portion HP′ illustrated in FIGS. 25 and 26 may beprovided in a peeling apparatus to perform the peeling operation.

FIGS. 27 to 30 are views illustrating a method of peeling a protectivefilm using the head portion of FIGS. 25 and 26.

Referring to FIG. 27, a mother panel M_P may be moved under the headportion HP′ by a stage. The mother panel M_P and the stage may have thesame components as the mother panel M_P and the stage STG illustrated inFIGS. 7 to 10.

The rotation of the first and second guide rollers GRO1 and GRO2 may bestopped, and the first dummy portion DUM1 of the mother panel M_P may bedisposed to overlap with the peeling tape PTP′ disposed between thefirst and second guide rollers GRO1 and GRO2.

Referring to FIG. 28, the first and second pressing portions PS1′ andPS2′ may be moved in the downward direction by the second drivingportion DV2′, and the second pressing portion PS2′ may press the peelingtape PTP′ between the first and second guide rollers GRO1 and GRO2 tothe first dummy portion DUM1 to attach the peeling tape PTP′ to thefirst dummy portion DUM1.

Referring to FIG. 29, the first driving portion DV1′ may move the first,second and third support portions SP1, SP2 and SP3 in the upwarddirection. The first and second guide portions GD1 and GD2, the firstand second guide rollers GRO1 and GRO2 and the pressing portion PS maybe moved in the upward direction. Thus, the first dummy portion DUM1attached to the peeling tape PTP′ may be peeled from the mother panelM_P, and a predetermined portion of the second dummy portion DUM2 mayalso be peeled from the mother panel M_P. The grip portion GP may bemoved in the downward direction by the third driving portion DV3′, andthe first and second grip portions GP1 and GP2 may move close to eachother to grip the peeled predetermined portion of the second dummyportion DUM2.

Referring to FIG. 30, after the grip portion GP grips the peeledpredetermined portion of the second dummy portion DUM2, the stage maymove in the right direction of the first direction DR1 to move away fromthe grip portion GP. Thus, a remaining portion of the dummy portion DUMmay be peeled from the mother panel M_P by the grip portion GP while themother panel M_P moves.

The first and second guide rollers GRO1 and GRO2 may rotate to move thepeeling tape PTP′, and thus the dummy portion DUM attached to thepeeling tape PTP′ may be detached from the peeling tape PTP′. The peeleddummy portion DUM may be discarded into a dummy box. As a result, thepeeling apparatus according to the illustrated exemplary embodiment mayeasily peel the dummy portion DUM.

According to the protective film peeling apparatus and the method ofpeeling a protective film in the exemplary embodiments of the invention,the peeling tape may be attached to the dummy portion of the protectivefilm provided on the mother panel, and the dummy portion of theprotective film may be easily peeled using the peeling tape.

While the invention has been described with reference to exemplaryembodiments, it will be apparent to those skilled in the art thatvarious changes and modifications may be made without departing from thespirits and scopes of the invention. Therefore, it should be understoodthat the above exemplary embodiments are not limiting, but illustrative.Thus, the scopes of the invention are to be determined by the broadestpermissible interpretation of the following claims and theirequivalents, and shall not be restricted or limited by the foregoingdescription.

What is claimed is:
 1. A method of peeling a protective film, the methodcomprising: disposing one side of a peeling tape extending in a firstdirection on a tape support portion; moving a first pressing portiondisposed on the one side of the peeling tape in a downward direction topress and fix the one side of the peeling tape to the tape supportportion; moving a second pressing portion disposed on another side ofthe peeling tape in the downward direction to press and attach theanother side of the peeling tape to one side of a dummy portion of aprotective film of a mother panel; moving the second pressing portion inan upward direction and moving the tape support portion and the firstpressing portion in the upward direction to peel the one side of thedummy portion and a predetermined portion of the dummy portion; andpeeling a remaining portion of the dummy portion by gripping the peeledpredetermined portion of the dummy portion with a grip portion.
 2. Themethod of claim 1, wherein the peeling the remaining portion of thedummy portion comprises: moving the grip portion in the downwarddirection so as to be disposed below the tape support portion; grippingthe peeled predetermined portion of the dummy portion with the gripportion; moving the first pressing portion in the upward direction toseparate the first pressing portion from the one side of the peelingtape; and moving a stage, on which the mother panel is placed, in thefirst direction to allow the mother panel to move away from the gripportion.
 3. The method of claim 2, further comprising: pressing theprotective film adjacent to the one side of the dummy portion by afixing portion disposed on one side of the stage adjacent to the oneside of the dummy portion.
 4. The method of claim 1, wherein the dummyportion comprises: a first dummy portion defined as the one side of thedummy portion; and a second dummy portion extending from the first dummyportion in the first direction, wherein the mother panel comprises: apanel; the protective film disposed on the panel; and an adhesive memberdisposed between the panel and the protective film to attach theprotective film to the panel, wherein the panel comprises: a pluralityof unit panels arranged in the first direction, wherein each of theplurality of unit panels comprises: a bending portion extending in thefirst direction, and wherein the second dummy portion overlaps with thebending portion in each of the plurality of unit panels.
 5. The methodof claim 4, wherein the peeling tape comprises: a peeling adhesiveprovided on the another side of the peeling tape to attach the anotherside of the peeling tape to the first dummy portion, wherein an adhesivestrength of the peeling adhesive is stronger than an adhesive strengthof the adhesive member, wherein a width of the first dummy portion in asecond direction intersecting the first direction is greater than awidth of the second dummy portion in the second direction, and wherein awidth of the peeling tape in the second direction is equal to or lessthan the width of the first dummy portion.
 6. The method of claim 4,further comprising: sucking carbonized particles of the adhesive memberoverlapping with the first dummy portion by a suction portion disposedbetween the first and second pressing portions when the first dummyportion is peeled.
 7. The method of claim 1, wherein the grip portioncomprises: a first grip portion; and a second grip portion spaced apartfrom the first grip portion, wherein the second pressing portion movesin the downward direction and the upward direction between the firstgrip portion and the second grip portion, and wherein the first andsecond grip portions move in the downward direction so as to be disposedbelow the tape support portion and move close to each other to grip thepeeled predetermined portion of the dummy portion, after thepredetermined portion of the dummy portion is peeled.
 8. The method ofclaim 7, wherein the first grip portion comprises: a first sub-gripportion; and a second sub-grip portion connected to a bottom of thefirst sub-grip portion and having an L-shape when viewed in a seconddirection intersecting the first direction, wherein the second gripportion comprises: a third sub-grip portion; and a fourth sub-gripportion connected to a bottom of the third sub-grip portion and havingan L-shape when viewed in the second direction, wherein the second andfourth sub-grip portions move close to each other to grip the peeledpredetermined portion of the dummy portion.
 9. The method of claim 8,wherein the grip portion further comprises: anti-adhesion coating layersrespectively provided on one side surface of the second sub-grip portionand one side surface of the fourth sub-grip portion which face eachother; and a plurality of air jet holes provided at the one side surfaceof the second sub-grip portion and the one side surface of the fourthsub-grip portion, wherein the one side surface of the second sub-gripportion and the one side surface of the fourth sub-grip portion haveuneven structures.
 10. A method of peeling a protective film, the methodcomprising: providing a peeling tape extending in a first direction to afirst guide roller and a second guide roller which rotate; stopping therotation of the first and second guide rollers and moving a pressingportion in a downward direction to press and attach the peeling tapebetween the first and second guide rollers to one side of a dummyportion of a protective film on a panel; moving the first and secondguide rollers and the pressing portion in an upward direction to peelthe one side of the dummy portion and a predetermined portion of thedummy portion; and moving a grip portion in the downward direction andgripping the peeled predetermined portion of the dummy portion with thegrip portion to peel a remaining portion of the dummy portion.